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Semiconductor Equipment Parts
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Precision Tolerance CNC Machining Parts For Semiconductor Packaging And Inspection Equipment

Precision Tolerance CNC Machining Parts For Semiconductor Packaging And Inspection Equipment

Brand Name: Yiding
MOQ: 1
Payment Terms: L/C,D/A,D/P,T/T,Western Union,MoneyGram
Detail Information
Place of Origin:
Guanddong, China
Certification:
ISO9001:2015; Rhos
Material Options:
Stainless Steel (304, 316), Aluminum Alloys (6061, 7075), Tool Steel, Titanium, Engineering Plastics (POM, PTFE, Peek)
Processing Methods:
CNC Turning, CNC Milling, Grinding, Wire EDM, Drilling, Tapping
Tolerance Capability:
General ±0.01mm; High Precision Up To ±0.005mm
Surface Finishing:
Anodizing, Electropolishing, Nickel Plating, Passivation, Black Oxide, Sandblasting
Heat Treatment:
Quenching, Tempering, Annealing, Stress Relieving (as Required)
Inspection & Quality Control:
100% Inspection Before Shipment; CMM (Coordinate Measuring Machine), Surface Roughness Tester, Hardness Testing
Certification Available:
ISO 9001, Material Certificate, RoHS/REACH Compliance, COC (Certificate Of Conformance)
Applications:
Semiconductor Inspection Systems, Wafer Testing Equipment, Probe Stations, Alignment Fixtures, Precision Holders
Prototyping & Production:
Rapid Prototyping, Small Batch Production, Large Volume Production
Lead Time:
5–20 Working Days Depending On Order Volume And Complexity
Packaging:
Foam, Anti-static Blister Tray, Vacuum Packing, Carton, Pallet – As Per Customer Requirements
Highlight:

Semiconductor Equipment CNC Machining Parts

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Precision Tolerance CNC Machining Parts

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Precision Tolerance semiconductor equipment spares

Product Description
Precision CNC Machined Semiconductor Parts with ±0.005mm Tolerance
High precision CNC machining parts designed specifically for semiconductor packaging and inspection equipment, manufactured to exacting standards for optimal performance in critical applications.
Product Specifications
Attribute Value
Material Options Stainless Steel (304, 316), Aluminum Alloys (6061, 7075), Tool Steel, Titanium, Engineering Plastics (POM, PTFE, Peek)
Processing Methods CNC Turning, CNC Milling, Grinding, Wire EDM, Drilling, Tapping
Tolerance Capability General ±0.01mm; High Precision up to ±0.005mm
Surface Finishing Anodizing, Electropolishing, Nickel Plating, Passivation, Black Oxide, Sandblasting
Heat Treatment Quenching, Tempering, Annealing, Stress Relieving (as required)
Inspection & Quality Control 100% inspection before shipment; CMM (Coordinate Measuring Machine), Surface Roughness Tester, Hardness Testing
Certification Available ISO 9001, Material Certificate, RoHS/REACH Compliance, COC (Certificate of Conformance)
Applications Semiconductor Inspection Systems, Wafer Testing Equipment, Probe Stations, Alignment Fixtures, Precision Holders
Prototyping & Production Rapid Prototyping, Small Batch Production, Large Volume Production
Lead Time 5-20 working days depending on order volume and complexity
Packaging Foam, Anti-static Blister Tray, Vacuum Packing, Carton, Pallet - as per customer requirements
Semiconductor production demands specialized CNC machined parts for wafer manufacturing, oxidation, photolithography, etching, and inspection processes. These components vary in complexity, size, and materials, requiring expert CNC machining knowledge for proper fabrication.
Our Materials Catalogue
We offer a comprehensive selection of plastic, metal, and composite materials for manufacturing:
Plastics
ABS, ABS+PC, PC, PP, PEEK, POM, Acrylic (PMMA), Teflon, PS, HDPE, PPS, PA6, PA66, PEI, PVC, PET, PTFE, and many more.
Metals
Aluminum, Brass, Copper, Magnesium, Titanium, Stainless Steel, Tin, Zinc, and additional options upon request.
These represent our most common materials for CNC prototyping and production parts. Our team can work with virtually any machinable plastic or metal to meet your unique application needs.
Key Considerations for Semiconductor CNC Machining
  • Precision is paramount: High-level semiconductor manufacturing requires super-precise components for uniform chemical application and electrical property inspection.
  • Material expertise: Semiconductor components utilize various non-metal materials including ceramics, quartz, polyurethane, and silicone carbide, each presenting unique machining challenges at tight tolerances.
  • Process optimization: Complex geometries like semiconductor chamber housings require machining strategies that minimize multiple part setups to maintain vacuum sealing while maximizing precision and productivity.