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Customizable Precision CNC Machined Components Semiconductor Equipment Parts

Brand Name:	Yiding
MOQ:	1
Payment Terms:	L/C,D/A,D/P,T/T,Western Union,MoneyGram
Supply Ability:	5000 peice/week

Detail Information

Product Description

Detail Information

Place of Origin:

Guanddong, China

Certification:

ISO9001:2015; Rhos

Material Options:

Stainless Steel (304, 316), Aluminum Alloys (6061, 7075), Tool Steel, Titanium, Engineering Plastics (POM, PTFE, Peek)

Processing Methods:

CNC Turning, CNC Milling, Grinding, Wire EDM, Drilling, Tapping

Tolerance Capability:

General ±0.01mm; High Precision Up To ±0.005mm

Surface Finishing:

Anodizing, Electropolishing, Nickel Plating, Passivation, Black Oxide, Sandblasting

Heat Treatment:

Quenching, Tempering, Annealing, Stress Relieving (as Required)

Inspection & Quality Control:

100% Inspection Before Shipment; CMM (Coordinate Measuring Machine), Surface Roughness Tester, Hardness Testing

Certification Available:

ISO 9001, Material Certificate, RoHS/REACH Compliance, COC (Certificate Of Conformance)

Applications:

Semiconductor Inspection Systems, Wafer Testing Equipment, Probe Stations, Alignment Fixtures, Precision Holders

Prototyping & Production:

Rapid Prototyping, Small Batch Production, Large Volume Production

Lead Time:

5–20 Working Days Depending On Order Volume And Complexity

Packaging:

Foam, Anti-static Blister Tray, Vacuum Packing, Carton, Pallet – As Per Customer Requirements

Highlight:

Customizable CNC Machined Components

Customizable Semiconductor Equipment Parts

Precision Semiconductor Equipment Parts

Product Description

Precision CNC Machined Parts for Semiconductor Equipment

High Precision CNC Machining Part for Semiconductor Packaging Equipment

Product Specifications

Attribute	Value
Material Options	Stainless Steel (304, 316), Aluminum Alloys (6061, 7075), Tool Steel, Titanium, Engineering Plastics (POM, PTFE, Peek)
Processing Methods	CNC Turning, CNC Milling, Grinding, Wire EDM, Drilling, Tapping
Tolerance Capability	General ±0.01mm; High Precision up to ±0.005mm
Surface Finishing	Anodizing, Electropolishing, Nickel Plating, Passivation, Black Oxide, Sandblasting
Heat Treatment	Quenching, Tempering, Annealing, Stress Relieving (as required)
Inspection & Quality Control	100% inspection before shipment; CMM (Coordinate Measuring Machine), Surface Roughness Tester, Hardness Testing
Certification Available	ISO 9001, Material Certificate, RoHS/REACH Compliance, COC (Certificate of Conformance)
Applications	Semiconductor Inspection Systems, Wafer Testing Equipment, Probe Stations, Alignment Fixtures, Precision Holders
Prototyping & Production	Rapid Prototyping, Small Batch Production, Large Volume Production
Lead Time	5-20 working days depending on order volume and complexity
Packaging	Foam, Anti-static Blister Tray, Vacuum Packing, Carton, Pallet - as per customer requirements

Semiconductor production demands specialized CNC machined parts for wafer manufacturing, oxidation, photolithography, etching, and inspection processes. These components vary in complexity, size, and materials, requiring expert CNC machining knowledge for proper fabrication.

Our Materials Catalogue

We offer a wide selection of plastic, metal, and composite materials for manufacturing. Our capabilities include working with metals such as aluminum, magnesium, steel, titanium, brass, and more. Beyond our standard stock, we can also source specific materials and provide machining with custom raw materials tailored to the requirements of your part.

Plastics:

ABS, ABS+PC, PC, PP, PEEK, POM, Acrylic (PMMA), Teflon, PS, HDPE, PPS, PA6, PA66, PEI, PVC, PET, PTFE, and many more.

Metals:

Aluminum, Brass, Copper, Magnesium, Titanium, Stainless Steel, Tin, Zinc, and additional options upon request.

These are the most common materials used for CNC prototyping and production parts. However, we are not limited to this list--our team can work with virtually any machinable plastic or metal to meet your unique application needs.

Key Considerations for Semiconductor CNC Machining

Precision is paramount: High-level semiconductor manufacturing requires super-precise components for uniform chemical application and electrical property inspection. Special high-speed, high-precision machining solutions optimize workpiece quality.
Material expertise: Semiconductor components utilize various non-metal materials including ceramics, quartz, polyurethane, and silicone carbide, each presenting unique machining challenges at tight tolerances.
Process optimization: Complex geometries like semiconductor chamber housings require machining strategies that minimize multiple part setups to maintain vacuum sealing while maximizing precision and productivity.

Overview of Processing Equipment
We operate a total of 45 modern machining units, including:

CNC Machining Centers: CNC650 (4 units), CNC850 (6 units), CNC1100 (4 units)
CNC Tapping Centers: JC-30C (5 units), T-740 (5 units)
Jingdiao Precision Engraving and Milling Machine: 400TE (2 unit)
CNC Lathes: including turning-milling integrated BX32C, CAK085, and others
A variety of milling machines, surface grinders, large and medium water mills, wire-cutting machines, and EDM
Accuracy range: from 0.001mm to 0.02mm, meeting diverse precision machining requirements

Inspection Equipment
Our quality control system is supported by precision measuring instruments such as a 2.5D Optical Projector, standard projectors, and height gauges.

We are committed to delivering excellence through technology and quality. Customers worldwide are welcome to contact us for business cooperation.

Tags:

CNC Machining Service

CNC Turning Service

Sheet Metal Fabrication

Semiconductor Equipment Parts

IC Test Socket

Wire EDM Machining Services

Grinding Services

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