Precision CNC Machined Parts for Semiconductor Equipment
High Precision CNC Machining Part for Semiconductor Packaging Equipment
Product Specifications
| Attribute |
Value |
| Material Options |
Stainless Steel (304, 316), Aluminum Alloys (6061, 7075), Tool Steel, Titanium, Engineering Plastics (POM, PTFE, Peek) |
| Processing Methods |
CNC Turning, CNC Milling, Grinding, Wire EDM, Drilling, Tapping |
| Tolerance Capability |
General ±0.01mm; High Precision up to ±0.005mm |
| Surface Finishing |
Anodizing, Electropolishing, Nickel Plating, Passivation, Black Oxide, Sandblasting |
| Heat Treatment |
Quenching, Tempering, Annealing, Stress Relieving (as required) |
| Inspection & Quality Control |
100% inspection before shipment; CMM (Coordinate Measuring Machine), Surface Roughness Tester, Hardness Testing |
| Certification Available |
ISO 9001, Material Certificate, RoHS/REACH Compliance, COC (Certificate of Conformance) |
| Applications |
Semiconductor Inspection Systems, Wafer Testing Equipment, Probe Stations, Alignment Fixtures, Precision Holders |
| Prototyping & Production |
Rapid Prototyping, Small Batch Production, Large Volume Production |
| Lead Time |
5-20 working days depending on order volume and complexity |
| Packaging |
Foam, Anti-static Blister Tray, Vacuum Packing, Carton, Pallet - as per customer requirements |
Semiconductor production demands specialized CNC machined parts for wafer manufacturing, oxidation, photolithography, etching, and inspection processes. These components vary in complexity, size, and materials, requiring expert CNC machining knowledge for proper fabrication.
Our Materials Catalogue
We offer a wide selection of plastic, metal, and composite materials for manufacturing. Our capabilities include working with metals such as aluminum, magnesium, steel, titanium, brass, and more. Beyond our standard stock, we can also source specific materials and provide machining with custom raw materials tailored to the requirements of your part.
Plastics:
ABS, ABS+PC, PC, PP, PEEK, POM, Acrylic (PMMA), Teflon, PS, HDPE, PPS, PA6, PA66, PEI, PVC, PET, PTFE, and many more.
Metals:
Aluminum, Brass, Copper, Magnesium, Titanium, Stainless Steel, Tin, Zinc, and additional options upon request.
These are the most common materials used for CNC prototyping and production parts. However, we are not limited to this list--our team can work with virtually any machinable plastic or metal to meet your unique application needs.
Key Considerations for Semiconductor CNC Machining
- Precision is paramount: High-level semiconductor manufacturing requires super-precise components for uniform chemical application and electrical property inspection. Special high-speed, high-precision machining solutions optimize workpiece quality.
- Material expertise: Semiconductor components utilize various non-metal materials including ceramics, quartz, polyurethane, and silicone carbide, each presenting unique machining challenges at tight tolerances.
- Process optimization: Complex geometries like semiconductor chamber housings require machining strategies that minimize multiple part setups to maintain vacuum sealing while maximizing precision and productivity.
Overview of Processing Equipment
We operate a total of 45 modern machining units, including:
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CNC Machining Centers: CNC650 (4 units), CNC850 (6 units), CNC1100 (4 units)
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CNC Tapping Centers: JC-30C (5 units), T-740 (5 units)
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Jingdiao Precision Engraving and Milling Machine: 400TE (2 unit)
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CNC Lathes: including turning-milling integrated BX32C, CAK085, and others
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A variety of milling machines, surface grinders, large and medium water mills, wire-cutting machines, and EDM
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Accuracy range: from 0.001mm to 0.02mm, meeting diverse precision machining requirements
Inspection Equipment
Our quality control system is supported by precision measuring instruments such as a 2.5D Optical Projector, standard projectors, and height gauges.
We are committed to delivering excellence through technology and quality. Customers worldwide are welcome to contact us for business cooperation.
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