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OEM ODM Precision CNC Machined Parts Semiconductor Inspection Equipment CNC Components

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OEM ODM Precision CNC Machined Parts Semiconductor Inspection Equipment CNC Components

Large Image : OEM ODM Precision CNC Machined Parts Semiconductor Inspection Equipment CNC Components

Product Details:

Place of Origin:	Guangdong, China
Brand Name:	Yiding
Certification:	ISO9001; Rhos

Payment & Shipping Terms:

Minimum Order Quantity:	1piece
Delivery Time:	7-10days
Payment Terms:	L/C,D/A,D/P,T/T,Western Union,MoneyGram

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Detailed Product Description

Material Options:	Stainless Steel (304, 316), Aluminum Alloys (6061, 7075), Tool Steel, Titanium, Engineering Plastics (POM, PTFE, Peek)	Processing Methods:	CNC Turning, CNC Milling, Grinding, Wire EDM, Drilling, Tapping
Tolerance Capability:	General ±0.01mm; High Precision Up To ±0.005mm	Surface Finishing:	Anodizing, Electropolishing, Nickel Plating, Passivation, Black Oxide, Sandblasting
Heat Treatment:	Quenching, Tempering, Annealing, Stress Relieving (as Required)	Inspection & Quality Control:	100% Inspection Before Shipment; CMM (Coordinate Measuring Machine), Surface Roughness Tester, Hardness Testing
Certification Available:	ISO 9001, Material Certificate, RoHS/REACH Compliance, COC (Certificate Of Conformance)	Applications:	Semiconductor Inspection Systems, Wafer Testing Equipment, Probe Stations, Alignment Fixtures, Precision Holders
Prototyping & Production:	Rapid Prototyping, Small Batch Production, Large Volume Production	Lead Time:	5–20 Working Days Depending On Order Volume And Complexity
Packaging:	Foam, Anti-static Blister Tray, Vacuum Packing, Carton, Pallet – As Per Customer Requirements
Highlight:	OEM ODM CNC Machined Parts , OEM Semiconductor Inspection Equipment parts , Semiconductor Inspection Equipment CNC Components

Semiconductor Inspection Equipment Component

Product Specifications

Material Options	Stainless Steel (304, 316), Aluminum Alloys (6061, 7075), Tool Steel, Titanium, Engineering Plastics (POM, PTFE, Peek)
Processing Methods	CNC Turning, CNC Milling, Grinding, Wire EDM, Drilling, Tapping
Tolerance Capability	General ±0.01mm; High Precision up to ±0.005mm
Surface Finishing	Anodizing, Electropolishing, Nickel Plating, Passivation, Black Oxide, Sandblasting
Heat Treatment	Quenching, Tempering, Annealing, Stress Relieving (as required)
Inspection & Quality Control	100% inspection before shipment; CMM (Coordinate Measuring Machine), Surface Roughness Tester, Hardness Testing
Certification Available	ISO 9001, Material Certificate, RoHS/REACH Compliance, COC (Certificate of Conformance)
Applications	Semiconductor Inspection Systems, Wafer Testing Equipment, Probe Stations, Alignment Fixtures, Precision Holders
Prototyping & Production	Rapid Prototyping, Small Batch Production, Large Volume Production
Lead Time	5–20 working days depending on order volume and complexity
Packaging	Foam, Anti-static Blister Tray, Vacuum Packing, Carton, Pallet – as per customer requirements

Advanced Semiconductor Material Processing

Semiconductor materials such as silicon, gallium arsenide, and compound semiconductors demand exceptional precision during processing to preserve their electrical and thermal performance. These materials are widely used in high-performance applications where heat dissipation and structural reliability are critical.

Our expertise includes state-of-the-art techniques such as laser ablation, EDM, and micro-milling, enabling micro- to sub-micron level accuracy. This ensures that the intrinsic properties of the materials remain intact while meeting the rigorous performance and reliability requirements of next-generation semiconductor devices.

Our semiconductor inspection equipment components are manufactured through advanced CNC machining processes to deliver the highest levels of precision, consistency, and reliability required by the semiconductor industry.

Sub-Micron Precision You Can Trust

In semiconductor manufacturing, every micron matters. Tolerances as tight as 1-5 microns are essential to ensure flawless device performance. Our advanced CNC systems, ultra-precision spindles, and real-time feedback technology enable consistent sub-micron accuracy.

We work with a wide variety of high-performance materials including stainless steel, aluminum alloys, tool steel, titanium, and engineering plastics (POM, PTFE, PEEK). With tolerance capabilities down to ± 0.005mm, our machining process guarantees the exact fit and flawless functionality your applications demand.

Key Advantages

✔ Ultra-High Precision CNC Machining
✔ Wide Range of Materials & Finishes
✔ Strict Quality Control & Certification
✔ OEM/ODM Support with Rapid Prototyping
✔ Reliable Packaging & Global Delivery

Tag:

precision cnc machined parts,

semiconductor equipment spare parts,

Metal Machined Parts

Contact Details

Dongguan Yiding Technologies Co., Ltd.

Contact Person: Stacey

Tel: 8618813380923

Other Products

Surface Finishing CNC Metal Machined Parts For Semiconductor Equipment Spares

Material Options: Stainless Steel (304, 316), Aluminum Alloys (6061, 7075), Tool Steel, Titanium, Engineering Plastics (POM, PTFE, Peek)