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Customization Precision Machined Semiconductor Test Socket High Performance

Brand Name:	Yiding
MOQ:	5
Supply Ability:	1000peice/week

Detail Information

Product Description

Detail Information

Place of Origin:

Guangdong, China

Certification:

ISO 9001

Material Specification:

Stainless Steel 17-4PH (standard), Beryllium Copper (high-cycle), Titanium (lightweight); Optional Nickel Or Gold Plating.

Dimensional Tolerances:

Critical Features – ±0.005 Mm (device Alignment); Overall Body – ±0.02 Mm

Flatness/Coplanarity:

≤0.01 Mm Across Seating Surface (ensures Uniform Contact Pressure).

Pin/Lead Channel Width & Depth:

Width – ±0.003 Mm; Depth – ±0.005 Mm (adjustable For Lead Deflection).

Pin/Lead Channel Pitch Accuracy:

±0.005 Mm (fine-pitch ICs), ±0.01 Mm (standard).

Highlight:

Precision Machined Semiconductor Test Socket

Semiconductor Test Socket High Performance

Customization semiconductor socket

Product Description

Semiconductor Test Socket Guide

Product Overview

The Semiconductor Test Socket Guide is engineered to deliver consistent performance across thousands of test insertions. By controlling vertical axis movement, it prevents off-axis actuation that can cause uneven contact force or premature probe wear. Precision-machined guide holes with chamfered lead-ins and optimized clearance profiles ensure smooth compression of pogo pins. The result is repeatable contact resistance, extended socket life, and superior reliability in high-throughput ATE environments.

Surface & Finish

Contact Channels: Ra ≤ 0.2 µm (mirror finish)
Non-Contact Surfaces: Ra ≤ 0.8 µm
Burr-Free: Micro-deburred edges, ISO 13715 compliant

Protective Coatings & Plating Options

Hard-coat anodizing (Aluminum)
Electroless Nickel (50-100 µin)
Gold Flash (0.1-0.3 µin) for enhanced conductivity

Cleanliness & Packaging

Class 100 cleanroom packaging
Non-volatile residue <5 µg/cm²
Ion-free option available

Certifications

ISO 9001:2015 | IPC-9592 (High-Reliability) | MIL-STD-883

Technical Advantages

Built from CTE-matched polymers or ceramic-filled compounds for resistance to thermal distortion
Maintains dimensional stability at temperatures >150 °C during HTOL and burn-in procedures
Prevents warping, misalignment, or probe disengagement under thermal cycling
Designed for >100,000 insertions with high-hardness composites and abrasion-resistant materials
PTFE fillers or dry-film coatings reduce friction, galling, and particle generation

With its precision engineering, the Semiconductor Test Socket Guide ensures dimensional integrity, long-term durability, and reliable test results — even under demanding mechanical and thermal conditions.

Product Advantages

High-Precision Fabrication: German-imported laser cutting machines ensure ±0.1mm tolerance.
Fast Delivery: Standard orders shipped within 3–7 days.
Flexible Customization: Supports single-piece prototyping, small-batch, and large-scale production.
Strict Quality Control: ISO9001-certified quality management, full inspection before shipment.
Comprehensive Services: From design optimization to finished products, reducing dependency on multiple suppliers.

Tags:

CNC Machining Service

CNC Turning Service

Sheet Metal Fabrication

Semiconductor Equipment Parts

IC Test Socket

Wire EDM Machining Services

Grinding Services

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