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Customization Precision Machined Semiconductor Test Socket High Performance

China Dongguan Yiding Technologies Co., Ltd. certification
China Dongguan Yiding Technologies Co., Ltd. certification
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Customization Precision Machined Semiconductor Test Socket High Performance

Customization Precision Machined Semiconductor Test Socket High Performance
Customization Precision Machined Semiconductor Test Socket High Performance

Large Image :  Customization Precision Machined Semiconductor Test Socket High Performance

Product Details:
Place of Origin: Guangdong, China
Brand Name: Yiding
Certification: ISO 9001
Payment & Shipping Terms:
Minimum Order Quantity: 5
Delivery Time: 10-15Business days
Supply Ability: 1000peice/week
Detailed Product Description
Material Specification: Stainless Steel 17-4PH (standard), Beryllium Copper (high-cycle), Titanium (lightweight); Optional Nickel Or Gold Plating. Dimensional Tolerances: Critical Features – ±0.005 Mm (device Alignment); Overall Body – ±0.02 Mm
Flatness/Coplanarity: ≤0.01 Mm Across Seating Surface (ensures Uniform Contact Pressure). Pin/Lead Channel Width & Depth: Width – ±0.003 Mm; Depth – ±0.005 Mm (adjustable For Lead Deflection).
Pin/Lead Channel Pitch Accuracy: ±0.005 Mm (fine-pitch ICs), ±0.01 Mm (standard).
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Precision Machined Semiconductor Test Socket

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Semiconductor Test Socket High Performance

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Customization semiconductor socket

Semiconductor Test Socket Guide
Product Overview
The Semiconductor Test Socket Guide is engineered to deliver consistent performance across thousands of test insertions. By controlling vertical axis movement, it prevents off-axis actuation that can cause uneven contact force or premature probe wear. Precision-machined guide holes with chamfered lead-ins and optimized clearance profiles ensure smooth compression of pogo pins. The result is repeatable contact resistance, extended socket life, and superior reliability in high-throughput ATE environments.
Surface & Finish
  • Contact Channels: Ra ≤ 0.2 µm (mirror finish)
  • Non-Contact Surfaces: Ra ≤ 0.8 µm
  • Burr-Free: Micro-deburred edges, ISO 13715 compliant
Protective Coatings & Plating Options
  • Hard-coat anodizing (Aluminum)
  • Electroless Nickel (50-100 µin)
  • Gold Flash (0.1-0.3 µin) for enhanced conductivity
Cleanliness & Packaging
  • Class 100 cleanroom packaging
  • Non-volatile residue <5 µg/cm²
  • Ion-free option available
Certifications
ISO 9001:2015 | IPC-9592 (High-Reliability) | MIL-STD-883
Technical Advantages
  • Built from CTE-matched polymers or ceramic-filled compounds for resistance to thermal distortion
  • Maintains dimensional stability at temperatures >150 °C during HTOL and burn-in procedures
  • Prevents warping, misalignment, or probe disengagement under thermal cycling
  • Designed for >100,000 insertions with high-hardness composites and abrasion-resistant materials
  • PTFE fillers or dry-film coatings reduce friction, galling, and particle generation
With its precision engineering, the Semiconductor Test Socket Guide ensures dimensional integrity, long-term durability, and reliable test results — even under demanding mechanical and thermal conditions.

Product Advantages

  • High-Precision Fabrication: German-imported laser cutting machines ensure ±0.1mm tolerance.

  • Fast Delivery: Standard orders shipped within 3–7 days.

  • Flexible Customization: Supports single-piece prototyping, small-batch, and large-scale production.

  • Strict Quality Control: ISO9001-certified quality management, full inspection before shipment.

  • Comprehensive Services: From design optimization to finished products, reducing dependency on multiple suppliers.

 

Contact Details
Dongguan Yiding Technologies Co., Ltd.

Contact Person: Stacey

Tel: 8618813380923

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