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Professional IC Test Sockets for Semiconductor Testing

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Professional IC Test Sockets for Semiconductor Testing

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Detalhes do produto:

Lugar de origem:	Cantão, China
Marca:	Yiding
Certificação:	ISO9001:2015

Condições de Pagamento e Envio:

Quantidade de ordem mínima:	1
Detalhes da embalagem:	conforme o pedido do cliente
Tempo de entrega:	7-10 dias
Termos de pagamento:	D/A,L/C,D/P,T/T,Western Union,MoneyGram

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IC test sockets for semiconductor testing

professional IC test sockets

CNC machined IC test sockets

Professional IC Test Sockets for Semiconductor Testing

What Is an IC Burn-in Socket and Why Is It Essential in Electronic Testing?

In the development and production of electronic products, ICs (Integrated Circuits) serve as the core functional components. Their stability and reliability directly determine product performance and lifespan. However, ICs may gradually degrade or fail over time due to environmental factors such as temperature, humidity, and voltage fluctuations. To detect these potential risks before products reach the market, the IC burn-in socket has become an indispensable testing device.

What Is an IC Burn-in Socket?

An IC burn-in socket is a specialized testing device designed to accelerate the aging process of IC components, also known as an IC test socket. By simulating real-world environmental conditions—such as high temperature, low temperature, high humidity, and high voltage—it subjects the IC to continuous stress tests. This helps reveal potential failures early and allows engineers to evaluate long-term performance and reliability.

In simple terms, an IC burn-in socket acts as a "reliability testing platform," exposing the IC to rigorous stress conditions to ensure stable performance in real applications.

How an IC Burn-in Socket Works

IC burn-in sockets operate based on accelerated aging and environmental stress testing. Their core functions include:

Temperature Control System: Uses heating or cooling modules (such as Peltier devices) to simulate various temperature environments and measure IC performance under high or low temperatures.
Humidity Control: Simulates high-humidity conditions to evaluate the IC's durability in moisture-rich environments.
Voltage and Current Stress: Applies different voltages and currents through a power module to mimic diverse electrical conditions during actual operation.
Real-Time Monitoring and Data Analysis: Continuously records key parameters such as current, voltage, and temperature for subsequent evaluation and quality analysis.

These capabilities allow the IC burn-in socket to simulate long-term usage in a short period, helping engineers quickly identify potential issues.

Applications of IC Burn-in Sockets

IC burn-in sockets are widely used in:

Electronics Manufacturing: Screens out unstable or defective chips during production to ensure high-quality final products.
IC Research & Development: Evaluates newly designed ICs under various environmental conditions to validate performance and longevity.
Quality Control: Helps detect potential issues early, reducing returns and repair costs.
High-Reliability Industries: Such as aerospace, automotive electronics, and industrial control, where components must withstand extreme environments.

Importance of IC Burn-in Sockets

IC burn-in sockets play a crucial role in the electronics industry by:

Early Failure Detection: Identifying potential failures before chips enter the market, reducing field failure rates.
Design Optimization: Providing data that supports improvements in IC design and manufacturing processes.
Risk Reduction: Preventing costly failures and minimizing economic loss or brand damage.
Enhanced Product Reliability: Ensuring stable and dependable performance in end products.

Conclusion

As a key reliability testing device in the electronics industry, the IC burn-in socket simulates extreme environmental conditions to accelerate IC aging, enabling engineers to identify issues early, optimize designs, and enhance product reliability. Whether in IC production, R&D validation, or quality control, the IC burn-in socket plays an indispensable role.

etiqueta:

Soquete de ensaio de semicondutores,

Soquete de ensaio,

tomada de semicondutores

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Dongguan Yiding Technologies Co., Ltd.

Pessoa de Contato: Stacey

Telefone: 8618813380923

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Premium Custom Precision Machining Services – Multi-Process Manufacturing for Semiconductor & Industrial Applications

Max Machining Length: 1200 milímetros

Tolerância à precisão: Até ± 0,002 mm

Processos de usinagem: CNC, 4 eixos/5 eixos, torneamento, torneamento, EDM, retificação, chapa metálica

Materiais: Alumínio, aço inoxidável, aço carbono, cobre, latão, PEEK, POM, ABS, cerâmica

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Soquetes de ensaio semicondutores livres de Burr com engenharia de precisão de tolerância estreita

Especificação material: Aço inoxidável 17-4ph (padrão), cobre de berílio (alto ciclo), titânio (leve); níquel opcional ou re

Tolerâncias dimensionais: Características críticas - ± 0,005 mm (alinhamento do dispositivo); Corpo geral - ± 0,02 mm

Planicidade/coplanaridade: ≤0,01 mm na superfície do assento (garante pressão de contato uniforme).

Largura e profundidade do canal de pino/chumbo: Largura - ± 0,003 mm; Profundidade - ± 0,005 mm (ajustável para deflexão de chumbo).

Soquete de Teste de Semicondutores Usinado com Precisão de Alto Desempenho e Personalizado

Especificação material: Aço inoxidável 17-4ph (padrão), cobre de berílio (alto ciclo), titânio (leve); níquel opcional ou re

Tolerâncias dimensionais: Características críticas - ± 0,005 mm (alinhamento do dispositivo); Corpo geral - ± 0,02 mm

Planicidade/coplanaridade: ≤0,01 mm na superfície do assento (garante pressão de contato uniforme).

Largura e profundidade do canal de pino/chumbo: Largura - ± 0,003 mm; Profundidade - ± 0,005 mm (ajustável para deflexão de chumbo).