Enhancing Chip Test Efficiency with High-Performance Test Sockets and Test Wafers

2025-10-14

In chip R&D and mass production, testing plays a vital role in ensuring product quality and timely delivery. One semiconductor packaging and testing company faced unstable testing results and high contact resistance, affecting production efficiency and yield.

After analyzing the challenges, Yiding Technology quickly formed a dedicated engineering team to design a customized solution featuring high-precision test sockets and highly conductive test wafers. By optimizing pin structures and surface plating processes, the new design significantly improved signal stability and product durability.

As a result, the client’s test yield increased by about 8%, stability improved by 25%, and maintenance costs were reduced. The client highly recognized Yiding Technology’s rapid response, product quality, and technical expertise, establishing a long-term partnership.

Yiding Technology remains committed to innovation and professionalism, delivering reliable and efficient one-stop semiconductor testing solutions to customers worldwide.

CNC Machining Service

CNC Turning Service

Sheet Metal Fabrication

Semiconductor Equipment Parts

IC Test Socket

Wire EDM Machining Services

Grinding Services

Enhancing Chip Test Efficiency with High-Performance Test Sockets and Test Wafers

Enhancing Chip Test Efficiency with High-Performance Test Sockets and Test Wafers